Chia-Wei Ho

Title: Chia-Wei Ho: Innovator in Metal Heterojunction Structures

Introduction

Chia-Wei Ho is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work primarily focuses on enhancing the reliability and performance of metal interconnect structures.

Latest Patents

One of his latest patents involves a metal heterojunction structure with a capping metal layer. This patent describes techniques for protecting a metal interconnect structure from damage during chemical mechanical polishing processes. The innovation includes receding the metal interconnect structure to create a recess, where a metal cap structure is formed. Additionally, the upper portion of the dielectric layer is strained to include tensile stress, which helps to expand the dielectric layer against the metal cap structure, effectively reducing or eliminating gaps at the interface.

Career Highlights

Chia-Wei Ho has worked with notable companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Ltd. and Accton Technology Corporation. His experience in these organizations has allowed him to develop and refine his innovative techniques in semiconductor manufacturing.

Collaborations

Throughout his career, Chia-Wei has collaborated with talented individuals such as Chi-Jen Liu and Chun-Wei Hsu. These collaborations have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Chia-Wei Ho is a distinguished inventor whose work in metal heterojunction structures has significantly impacted the semiconductor industry. His innovative approaches continue to enhance the reliability and efficiency of metal interconnect technologies.