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Hsinchu, Taiwan

Chia-Ping Lai

USPTO Granted Patents = 79 (Patent Applications = 11)

Average Co-Inventor Count = 3.1

ph-index = 3

Forward Citations = 46(Granted Patents)

Forward Citations (Not Self Cited) = 21(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

78 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

1 out of 832,843

Other

patents

Years Active: 2015-2025

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Areas of Expertise:

Semiconductor Package

Image Sensor Device

Fan-Out Packages

Three-Dimensional Integrated Circuit

Optical Integrated Circuit

Photonic Device

Vertical Semiconductor Package

Interposer Structures

Guard Ring Structure

Deep Trench Capacitor

Embedded Integrated Passive Device

Fiber To Chip Coupler

79 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12495558 - Integrated circuit including trench capacitor (2025-12-09),

2. 12463099 - Semiconductor package including test line structure (2025-11-04),

3. 12439713 - Image sensor device (2025-10-07),

4. 12431467 - Fan-out packages providing enhanced mechanical strength and methods for forming the same (2025-09-30),

5. 12417987 - Semiconductor die including guard ring structure and three-dimensional device structure including the same (2025-09-16),

6. 12379557 - Semiconductor structure and method for forming the same (2025-08-05),

7. 12369420 - Methods for forming image sensors (2025-07-22),

8. 12364028 - Image sensor device and methods of forming the same (2025-07-15),

9. 12362323 - Three-dimensional integrated circuit (2025-07-15),

10. 12353034 - Optical integrated circuit structure including edge coupling protective features and method of forming same (2025-07-08),

11. 12334487 - Method for forming a semiconductor die and a photoelectric device integrated in a same package (2025-06-17),

12. 12322679 - Semiconductor die including through substrate via barrier structure and methods for forming the same (2025-06-03),

13. 12278167 - Semiconductor die including through substrate via barrier structure and methods for forming the same (2025-04-14),

14. 12272724 - Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same (2025-04-08),

15. 12261133 - Interposer with warpage-relief trenches (2025-03-25),

Title: The Innovative Journey of Chia-Ping Lai

Introduction:

Chia-Ping Lai, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chia-Ping Lai's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips for various applications.

Career Highlights:

With a career spanning over two decades, Chia-Ping Lai has worked tirelessly to push the boundaries of technological innovation. His work has led to the creation of several patented inventions that have revolutionized the industry.

Collaborations:

Throughout his career, Chia-Ping Lai has collaborated with leading tech companies and research institutions to further his research and bring his inventions to life. His collaborative efforts have resulted in the successful commercialization of several groundbreaking technologies.

Conclusion:

In conclusion, Chia-Ping Lai's passion for innovation and his dedication to technological advancement have solidified his position as a trailblazer in the world of inventors. His contributions continue to shape the future of technology and inspire the next generation of innovators.

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