Chia-Ping Lai

This inventor holds 87 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-0657). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Other. Active years: 2015-2026.

USPTO Granted Patents = 87 (Patent Applications = 12)

% Patents Active = 98.9

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 52(Granted Patents)

Forward Citations (Not Self Cited) = 21(Dec 10, 2025)

Inventors with similar research interests:

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Company Filing History:

86 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

1 out of 834,307

Other

patents

Years Active: 2015-2026

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Areas of Expertise:

Capacitor Device

Semiconductor Package

Integrated Circuit

Image Sensor

3D Stacking

Fan-Out Packages

Trench Capacitor

Through Substrate Via

Optical Integrated Circuit

Power Management Die

Guard Ring Structure

Hybrid Bond Contact

87 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12707653 - Thick redistribution layer features (2026-08-11),

2. 12684871 - Shielded deep trench capacitor structure and methods of forming the same (2026-07-14),

3. 12672591 - Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods for forming the same (2026-06-30),

4. 12616022 - Capacitor device and manufacturing method thereof (2026-04-28),

5. 12543593 - Semiconductor package including semiconductor dies having different lattice directions and method of forming the same (2026-02-03),

6. 12538850 - Semiconductor package including semiconductor dies having different lattice directions and method of forming the same (2026-01-27),

7. 12519021 - Semiconductor package including test line structure (2026-01-06),

8. 12514010 - Semiconductor device (2025-12-30),

9. 12495558 - Integrated circuit including trench capacitor (2025-12-09),

10. 12463099 - Semiconductor package including test line structure (2025-11-04),

11. 12439713 - Image sensor device (2025-10-07),

12. 12431467 - Fan-out packages providing enhanced mechanical strength and methods for forming the same (2025-09-30),

13. 12417987 - Semiconductor die including guard ring structure and three-dimensional device structure including the same (2025-09-16),

14. 12379557 - Semiconductor structure and method for forming the same (2025-08-05),

15. 12369420 - Methods for forming image sensors (2025-07-22),

Title: The Innovative Journey of Chia-Ping Lai

Introduction:

Chia-Ping Lai, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chia-Ping Lai's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips for various applications.

Career Highlights:

With a career spanning over two decades, Chia-Ping Lai has worked tirelessly to push the boundaries of technological innovation. His work has led to the creation of several patented inventions that have revolutionized the industry.

Collaborations:

Throughout his career, Chia-Ping Lai has collaborated with leading tech companies and research institutions to further his research and bring his inventions to life. His collaborative efforts have resulted in the successful commercialization of several groundbreaking technologies.

Conclusion:

In conclusion, Chia-Ping Lai's passion for innovation and his dedication to technological advancement have solidified his position as a trailblazer in the world of inventors. His contributions continue to shape the future of technology and inspire the next generation of innovators.