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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chia-Ping Lai

This inventor holds 87 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-0657). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Other. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Ping Lai. Retrieved from https://idiyas.com/inventor/chia-ping-lai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 87 

% Patents Active = 98.9

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 52(Granted Patents)

Forward Citations (Not Self Cited) = 21(Dec 10, 2025)


Inventors with similar research interests:

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Company Filing History:

goldMedal86 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal1 out of 834,453 
Other
 patents

Years Active: 2015-2026

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Areas of Expertise:
Capacitor Device
Semiconductor Package
Integrated Circuit
Image Sensor
3D Stacking
Fan-Out Packages
Trench Capacitor
Through Substrate Via
Optical Integrated Circuit
Power Management Die
Guard Ring Structure
Hybrid Bond Contact
87 patents (USPTO):Explore Patents
1. 12707653 - Thick redistribution layer features (2026-08-11),
2. 12684871 - Shielded deep trench capacitor structure and methods of forming the same (2026-07-14),
3. 12672591 - Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods for forming the same (2026-06-30),
4. 12616022 - Capacitor device and manufacturing method thereof (2026-04-28),
5. 12543593 - Semiconductor package including semiconductor dies having different lattice directions and method of forming the same (2026-02-03),
6. 12538850 - Semiconductor package including semiconductor dies having different lattice directions and method of forming the same (2026-01-27),
7. 12519021 - Semiconductor package including test line structure (2026-01-06),
8. 12514010 - Semiconductor device (2025-12-30),
9. 12495558 - Integrated circuit including trench capacitor (2025-12-09),
10. 12463099 - Semiconductor package including test line structure (2025-11-04),
11. 12439713 - Image sensor device (2025-10-07),
12. 12431467 - Fan-out packages providing enhanced mechanical strength and methods for forming the same (2025-09-30),
13. 12417987 - Semiconductor die including guard ring structure and three-dimensional device structure including the same (2025-09-16),
14. 12379557 - Semiconductor structure and method for forming the same (2025-08-05),
15. 12369420 - Methods for forming image sensors (2025-07-22),

Title: The Innovative Journey of Chia-Ping Lai

Introduction:

Chia-Ping Lai, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chia-Ping Lai's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips for various applications.

Career Highlights:

With a career spanning over two decades, Chia-Ping Lai has worked tirelessly to push the boundaries of technological innovation. His work has led to the creation of several patented inventions that have revolutionized the industry.

Collaborations:

Throughout his career, Chia-Ping Lai has collaborated with leading tech companies and research institutions to further his research and bring his inventions to life. His collaborative efforts have resulted in the successful commercialization of several groundbreaking technologies.

Conclusion:

In conclusion, Chia-Ping Lai's passion for innovation and his dedication to technological advancement have solidified his position as a trailblazer in the world of inventors. His contributions continue to shape the future of technology and inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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