IDiyas

For the Inventor, By the Inventor

Zhubei, Taiwan

Chia-Han Lai

USPTO Granted Patents = 21 

Average Co-Inventor Count = 6.0

ph-index = 4

Forward Citations = 41(Granted Patents)


Location History:

  • Zhubei, TW (2016 - 2022)
  • Hsinchu County, TW (2015 - 2024)

Company Filing History:

goldMedal21 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2025

Loading Chart...
21 patents (USPTO):
1. 12482705 - Conductive feature formation and structure using bottom-up filling deposition (2025-11-25),
2. 12362198 - Interface tool and methods of operation (2025-07-15),
3. 11929314 - Interconnect structures including a fin structure and a metal cap (2024-03-12),
4. 11532503 - Conductive feature structure including a blocking region (2022-12-20),
5. 11444028 - Contact structure and formation thereof (2022-09-13),
6. 10943823 - Conductive feature formation and structure using bottom-up filling deposition (2021-03-09),
7. 10847411 - Conductive feature formation and structure (2020-11-24),
8. 10804140 - Interconnect formation and structure (2020-10-13),
9. 10510664 - Contact structure and formation thereof (2019-12-17),
10. 10475702 - Conductive feature formation and structure using bottom-up filling deposition (2019-11-12),
11. 9978583 - Opening fill process and structures formed thereby (2018-05-22),
12. 9735107 - Contact structure and formation thereof (2017-08-15),
13. 9653594 - Semiconductor device and method for forming the same (2017-05-16),
14. 9627313 - Opening fill process and structure formed thereby (2017-04-18),
15. 9449922 - Contact critical dimension control (2016-09-20),

Title: Chia-Han Lai: A Leader in Semiconductor Innovations

Introduction: Chia-Han Lai is a prominent inventor based in Zhubei, Taiwan, recognized for his significant contributions to semiconductor technology. With an impressive portfolio of 19 patents, Lai has been instrumental in advancing the field through innovative designs and methodologies.

Latest Patents: Among his latest patents, Lai has developed interconnect structures that include a fin structure and a metal cap. This invention utilizes semiconductor processing tools to form a metal cap on a metal gate along with one or more dielectric layers. Furthermore, his patent details the creation of a recess within these dielectric layers, where a bottom-up deposition of metal material forms a metal plug directly on the metal cap. Another noteworthy patent from Lai involves a conductive feature structure, which includes a blocking region. This design incorporates multiple dielectric layers and conductive features, demonstrating effective methods for forming metal contacts, vias, and lines, while ensuring proper isolation between conductive elements.

Career Highlights: Chia-Han Lai is currently associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a global leader in semiconductor manufacturing. His innovative approaches have not only bolstered the company’s technological capabilities but have also set standards in the semiconductor industry.

Collaborations: Throughout his career, Lai has collaborated with various talented professionals, including colleagues Wei-Jung Lin and Chi-Yuan Chen. Their combined expertise has contributed to the successful development of groundbreaking technologies in semiconductor fabrication.

Conclusion: Chia-Han Lai exemplifies the spirit of innovation within the semiconductor field. His extensive patent portfolio and collaborative efforts with industry experts underscore his pivotal role in advancing semiconductor technology, making substantial impacts on both the company and the broader industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…