This inventor holds 3 USPTO granted patents. Top assignees: Asm Assembly Automation Limited, Asm Technology Singapore Pte Ltd, Asmpt Singapore Pte. Ltd.. Active years: 2012-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 124 
1 out of 234 
1 out of 36 Years Active: 2012-2023
Title: Chi Keung Leung: Innovator in Electronic Bonding Technologies
Introduction
Chi Keung Leung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic bonding technologies, holding a total of 3 patents. His innovative work focuses on improving the efficiency and effectiveness of electronic component handling and bonding processes.
Latest Patents
One of his latest patents is an "Ejector unit for detaching an electronic element from an adhesive carrier." This invention features an ejector housing with a supporting deck, a light source, and an ejector lens. The design allows the ejector lens to be oriented with an optical axis extending between the light source and an opening in the supporting deck. The lens is movable along the optical axis to project its protruding face against the electronic element, facilitating its lifting from the adhesive carrier.
Another significant patent is the "Apparatus and method of determining a bonding position of a die." This invention includes a bond head for picking up and bonding the die, along with multiple cameras configured to capture images of the die's surfaces. The method determines the bonding position based on these captured images, enhancing the precision of the bonding process.
Career Highlights
Chi Keung Leung has worked with prominent companies in the industry, including ASM Technology Singapore Pte Ltd and ASMPT Singapore Pte. Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in electronic bonding technologies.
Collaborations
Some of his notable coworkers include Kui Kam Lam and Shun Ming Fung. Their collaboration has likely contributed to the advancement of technologies in their field.
Conclusion
Chi Keung Leung's contributions to electronic bonding technologies through his patents and career experiences highlight his role as an influential inventor. His work continues to impact the industry positively, showcasing the importance of innovation in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile