Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Asmpt Singapore Pte. Ltd.

Chi Keung Leung

Kui Kam Lam

Wai Yuen Cheung

Kwok Kee Chung

Shun Ming Fung

Hua Zhang

Wing Kin Lam

Qing Long Zhang

Yuet Cheung

An ejector unit for detaching an electronic element from an adhesive carrier has an ejector housing with a supporting deck, a light source disposed therein and an ejector lens. The ejector lens has a protruding face. The ejector lens is disposed and oriented with an optical axis extending between the light source and an opening in the supporting deck, and the protruding face of the lens directed towards the opening. The ejector lens is movable relative to the supporting deck along the optical axis to project the protruding face through the opening against the electronic element for lifting the electronic element.

Ejector unit for detaching an electronic element from an adhesive carrier

The invention provides an apparatus for determining a bonding position of a die. The apparatus includes a bond head for picking up and bonding the die. The apparatus further includes a plurality of cameras positioned and configured for capturing at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. Further, the invention provides a method of determining a bonding position of a die. The method captures at least a first image including a first side surface of the die, a second image including a second side surface of the die and a third image including the first and second side surfaces of the die. The method further determines a bonding position of the die based on the captured images.

Apparatus and method of determining a bonding position of a die

A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

Automatic level adjustment for die bonder

Growing community of inventors

Hong Kong, China

Chi Keung Leung