The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2012
Filed:
Jul. 24, 2006
Kwok Kee Chung, Hong Kong, CN;
Kui Kam Lam, Hong Kong, CN;
Chi Keung Leung, Hong Kong, CN;
Wai Yuen Cheung, Hong Kong, CN;
Kwok Kee Chung, Hong Kong, CN;
Kui Kam Lam, Hong Kong, CN;
Chi Keung Leung, Hong Kong, CN;
Wai Yuen Cheung, Hong Kong, CN;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.