This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Asm Assembly Automation Limited. Active years: 2010-2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010-2012
Title: Kwok Kee Chung: Innovator in Die Bonding Technology
Introduction
Kwok Kee Chung is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, holding a total of 3 patents. His innovative approaches have advanced the efficiency and effectiveness of bonding processes in various applications.
Latest Patents
One of his latest patents is titled "Automatic Level Adjustment for Die Bonder." This invention provides a die bonding apparatus and method that automatically adjusts the level of a die bonder to compensate for any physical changes occurring during bonding. The bond arm support is drivable to a bonding level to position a die onto a bonding surface. A bond arm, which is slidably mounted to the bond arm support, holds and bonds the die. The bond arm is designed to move relative to the bond arm support upon contact of the die with the bonding surface. A measuring device determines the distance moved by the bond arm, and a controller adjusts the bonding level accordingly.
Another notable patent is "Direct Die Attach Utilizing Heated Bond Head." This method involves bonding a die with a solder layer that has a specific melting point. The bond head is heated to a temperature higher than the melting point, while the substrate is heated to a lower temperature. The bond head picks up the die and heats it to melt the solder layer, allowing the die to bond to the substrate. After bonding, the bond head is separated, allowing the solder layer to cool and solidify.
Career Highlights
Kwok Kee Chung is currently employed at Asm Assembly Automation Limited, where he continues to develop innovative solutions in the field of assembly automation. His work has been instrumental in enhancing the capabilities of die bonding technologies.
Collaborations
He collaborates with talented coworkers, including Ming Li and Ying Ding, who contribute to the innovative environment at Asm Assembly Automation Limited.
Conclusion
Kwok Kee Chung's contributions to die bonding technology through his patents and work at Asm Assembly Automation Limited highlight his role as a key innovator in the industry. His inventions continue to shape the future of bonding processes, demonstrating the importance of innovation in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile