The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2010
Filed:
Oct. 27, 2008
Ming LI, Kwai Chung, HK;
Ying Ding, Kwai Chung, HK;
Ping Liang Tu, Kwai Chung, HK;
King Ming Lo, Kwai Chung, HK;
Kwok Kee Chung, Kwai Chung, HK;
Ming Li, Kwai Chung, HK;
Ying Ding, Kwai Chung, HK;
Ping Liang Tu, Kwai Chung, HK;
King Ming Lo, Kwai Chung, HK;
Kwok Kee Chung, Kwai Chung, HK;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T, which is higher than Tm, and a substrate is heated to a substrate setting temperature T, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature Tso as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards Tand solidifies.