Company Filing History:
Years Active: 2010
Title: King Ming Lo: Innovator in Die Bonding Technology
Introduction
King Ming Lo is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology. With a focus on innovative methods, he has developed a unique approach that enhances the efficiency and effectiveness of die attachment processes.
Latest Patents
One of King Ming Lo's notable patents is titled "Direct die attach utilizing heated bond head." This patent describes a method for bonding a die that involves a solder layer with a specific melting point. The process includes heating a bond head to a temperature higher than the melting point of the solder layer while simultaneously heating a substrate to a lower temperature. The bond head picks up the die and heats it to melt the solder layer, allowing for a secure bond to the substrate. After the bonding process, the solder layer cools and solidifies, ensuring a reliable attachment.
Career Highlights
King Ming Lo is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of assembly automation. His work has been instrumental in advancing technologies that improve manufacturing processes. He has a total of 1 patent to his name, showcasing his commitment to innovation.
Collaborations
Throughout his career, King Ming Lo has collaborated with talented individuals such as Ming Li and Ying Ding. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
King Ming Lo's contributions to die bonding technology exemplify the spirit of innovation. His patent and work at Asm Assembly Automation Limited highlight his dedication to advancing manufacturing processes. His collaborations further enhance the impact of his inventions in the industry.