Company Filing History:
Years Active: 2010-2011
Title: The Innovative Contributions of Ping Liang Tu
Introduction
Ping Liang Tu is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on methods that enhance the bonding processes of semiconductor devices, which are crucial for modern electronics.
Latest Patents
One of his latest patents is titled "Method of bonding semiconductor devices utilizing solder balls." This method involves picking up a solder ball with a pick head, placing it onto a substrate, and melting the solder ball before placing the semiconductor device on it. The molten solder ball cools to form a strong solder joint, effectively bonding the semiconductor device to the substrate. Another significant patent is "Direct die attach utilizing heated bond head." This method describes a process where a bond head is heated to a temperature higher than the melting point of a solder layer on a die. The die is then pressed onto a substrate, allowing the solder layer to bond the die securely before cooling and solidifying.
Career Highlights
Ping Liang Tu is currently employed at Asm Assembly Automation Limited, where he continues to innovate in the field of semiconductor assembly. His expertise in bonding techniques has positioned him as a valuable asset to his company and the industry at large.
Collaborations
He collaborates with talented coworkers, including Ming Li and Ying Ding, who contribute to the innovative environment at Asm Assembly Automation Limited.
Conclusion
Ping Liang Tu's contributions to semiconductor technology through his patents and work at Asm Assembly Automation Limited highlight his role as a key innovator in the field. His methods for bonding semiconductor devices are paving the way for advancements in electronic manufacturing.