Asm Assembly Automation Limited

Ping Liang Tu

Kui Kam Lam

Ming Li

Deming Liu

Man Chung Raymond Ng

Chun Hung Samuel Ip

Kwok Kee Chung

Ying Ding

King Ming Lo

A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.

Method of bonding semiconductor devices utilizing solder balls

A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T, which is higher than Tm, and a substrate is heated to a substrate setting temperature T, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature Tso as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards Tand solidifies.

Direct die attach utilizing heated bond head

A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

Manufacturing process and apparatus therefor utilizing reducing gas

Growing community of inventors

Hong Kong, China

Ping Liang Tu