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Kaohsiung, Taiwan

Cheng-Yuan Kung

This inventor holds 32 USPTO granted patents and 18 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Yuan Kung. Retrieved from https://idiyas.com/inventor/cheng-yuan-kung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 87.5

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 19(Granted Patents)


Company Filing History:

goldMedal32 out of 1,964 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2019-2026

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Areas of Expertise:
Electronic Package
Semiconductor Device
Package Structure
Manufacturing Method
Assembly Structure
Capacitor Bank
Optical Devices
MEMS Device Package
Shielding Layer
Dielectric Layer
Conductive Contact
Semiconductor Process
32 patents (USPTO):Explore Patents
1. 12672530 - Electronic package (2026-06-30),
2. 12635572 - Package structure and method for manufacturing the same (2026-05-19),
3. 12628353 - Package structure (2026-05-12),
4. 12593740 - Package structure (2026-03-31),
5. 12513815 - Electronic device and method of manufacturing the same (2025-12-30),
6. 12463157 - Electronic package (2025-11-04),
7. 12368104 - Electronic package (2025-07-22),
8. 12272766 - Semiconductor device package and method of manufacturing the same (2025-04-08),
9. 12218075 - Package structure (2025-02-04),
10. 12051658 - Semiconductor package structure and method for manufacturing the same (2024-07-30),
11. 11935841 - Semiconductor package structure and method for manufacturing the same (2024-03-19),
12. 11923825 - Semiconductor device and method for manufacturing the same (2024-03-05),
13. 11798890 - Assembly structure and package structure (2023-10-24),
14. 11784111 - Semiconductor device and method for manufacturing the same (2023-10-10),
15. 11756896 - Semiconductor package structure including shielding layer contacting conductive contact (2023-09-12),

Title: The Innovative Journey of Cheng-Yuan Kung

Introduction:

Cheng-Yuan Kung, a distinguished inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents:

Cheng-Yuan Kung's latest patents include groundbreaking inventions in the realm of artificial intelligence and renewable energy technologies, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights:

With a career spanning over two decades, Cheng-Yuan Kung has established himself as a visionary in the tech industry. His work has been pivotal in revolutionizing how we interact with technology on a daily basis.

Collaborations:

Throughout his career, Cheng-Yuan Kung has collaborated with leading tech companies and research institutions worldwide, fostering a culture of innovation and knowledge-sharing within the industry.

Conclusion:

In conclusion, Cheng-Yuan Kung's relentless pursuit of innovation and his passion for creating technology that enhances our lives make him a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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