The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Jul. 22, 2021
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Cheng-Yuan Kung, Kaohsiung, TW;
Meng-Wei Hsieh, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H01L 23/552 (2006.01); H03H 9/10 (2006.01); H03H 9/54 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H03H 9/0552 (2013.01); H01L 23/552 (2013.01); H03H 9/0542 (2013.01); H03H 9/10 (2013.01); H03H 9/54 (2013.01); H05K 3/34 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4903 (2013.01); H01L 2924/14215 (2013.01);
Abstract
A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a carrier, an element, and a first electronic component. The element is disposed on the carrier. The first electronic component is disposed above the element. The element is configured to adjust a first bandwidth of a first signal transmitted from the first electronic component.