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Kaohsiung, Taiwan

Meng-Wei Hsieh

This inventor holds 24 USPTO granted patents and 14 published patent applications, primarily in Semiconductor Packaging. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng-Wei Hsieh. Retrieved from https://idiyas.com/inventor/meng-wei-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 24 

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 1

Forward Citations = 10(Granted Patents)


Location History:

  • Tainan, TW (2014)
  • Kaohsiung, TW (2021 - 2024)

Company Filing History:

goldMedal24 out of 1,971 
 
Advanced Semiconductor Engineering, Inc.
 patents

Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Device Package
Electronic Device
Manufacturing Method
Antenna Module
Package Structure
Reinforcement Component
Shielding Layer
Conductive Contact
Emitting Devices
Passive Element Network
24 patents (USPTO):Explore Patents
1. 12562454 - Semiconductor device package (2026-02-24),
2. 12513815 - Electronic device and method of manufacturing the same (2025-12-30),
3. 12476177 - Semiconductor package structure (2025-11-18),
4. 12463157 - Electronic package (2025-11-04),
5. 12374631 - Semiconductor device package and method of manufacturing the same (2025-07-29),
6. 12300602 - Semiconductor package structure and method for manufacturing the same (2025-05-13),
7. 12272766 - Semiconductor device package and method of manufacturing the same (2025-04-08),
8. 12154870 - Semiconductor device package comprising antenna and communication module (2024-11-26),
9. 12132248 - Electronic device (2024-10-29),
10. 11935841 - Semiconductor package structure and method for manufacturing the same (2024-03-19),
11. 11923825 - Semiconductor device and method for manufacturing the same (2024-03-05),
12. 11811131 - Antenna module (2023-11-07),
13. 11798858 - Semiconductor package structure including reinforcement component and method for manufacturing the same (2023-10-24),
14. 11756896 - Semiconductor package structure including shielding layer contacting conductive contact (2023-09-12),
15. 11594660 - Semiconductor device package (2023-02-28),

Title: The Innovative Journey of Meng-Wei Hsieh

Introduction: Meng-Wei Hsieh, a talented inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Meng-Wei Hsieh holds several patents in the areas of artificial intelligence, renewable energy, and biotechnology, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a background in engineering and a passion for creating solutions to complex problems, Meng-Wei Hsieh has had a successful career marked by numerous awards and recognitions for his innovative work.

Collaborations: Throughout his career, Meng-Wei Hsieh has collaborated with leading research institutions, universities, and tech companies to further develop and implement his inventions, solidifying his reputation as a visionary inventor.

Conclusion: Meng-Wei Hsieh's relentless pursuit of innovation and his dedication to pushing the boundaries of technology make him a true pioneer in the world of inventions, inspiring the next generation of inventors to dream big and create change.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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