The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2025

Filed:

Dec. 21, 2022
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Hsu-Chiang Shih, Kaohsiung, TW;

Cheng-Yuan Kung, Kaohsiung, TW;

Hung-Yi Lin, Kaohsiung, TW;

Meng-Wei Hsieh, Kaohsiung, TW;

Chien-Mei Huang, Kaohsiung, TW;

I-Ting Lin, Kaohsiung, TW;

Sheng-Wen Yang, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 2201/09827 (2013.01);
Abstract

The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a first redistribution structure and a first encapsulant. The first encapsulant supports the first redistribution structure and is configured to function as a first reinforcement to provide a second redistribution structure. The redistribution structure has a plurality of conductive layers disposed over the first redistribution structure.


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