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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12051658 B1

PDFFull Text
Date of Patent:
Jul. 30, 2024

Filed:

May. 31, 2022

Semiconductor package structure and method for manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Cheng-Yuan Kung, Kaohsiung, TW;

Hung-Yi Lin, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorney:

FOLEY & LARDNER LLP

Primary Examiner:

Jay C Chang

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2023.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/552 (2013.01); H01L 2223/6655 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A semiconductor package structure includes a redistribution structure and an impedance matching device. The redistribution structure includes a first surface, a second surface opposite to the first surface and a circuitless region extending from the first surface to the second surface. The impedance matching device is disposed on the redistribution structure and includes at least one impedance matching circuit aligned with the circuitless region.

Find Patent Forward Citations

Kung, Cheng-Yuan. (2024). Semiconductor package structure and method for manufacturing the same (U.S. Patent No. 12051658). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12051658

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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