The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 30, 2026

Filed:

Apr. 07, 2022
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Hung-Yi Lin, Kaohsiung, TW;

Cheng-Yuan Kung, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/20 (2026.01); H10W 90/00 (2026.01); H10W 74/15 (2026.01);
U.S. Cl.
CPC ...
H10W 20/20 (2026.01); H10W 90/00 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01); H10W 90/792 (2026.01);
Abstract

An electronic package is provided. The electronic package includes a processing component and a memory unit. The processing component has a side including a first region and a second region distinct from the first region. The memory unit is disposed over the first region. The first region is configured to provide interconnection between the processing component and the memory unit, and the second region is configured to provide external connection.


Find Patent Forward Citations

Lin, Hung-Yi. (2026). Electronic package (U.S. Patent No. 12672530). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12672530

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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