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Hsinchu, Taiwan

Cheng-Ming Weng

This inventor holds 5 USPTO granted patents. Top assignee: United Microelectronics Corp.. Active years: 2007-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Cheng-Ming Weng. Retrieved from https://idiyas.com/inventor/cheng-ming-weng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 3

Forward Citations = 27(Granted Patents)

Location History:

Hsin-Chu Hsien, TW (2007 - 2008)
Hsinchu County, TW (2007 - 2010)

Company Filing History:

United Microelectronics Corp.

Years Active: 2007-2010

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5 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7687446 - Method of removing residue left after plasma process (2010-03-30),

2. 7628866 - Method of cleaning wafer after etching process (2009-12-08),

3. 7378343 - Dual damascence process utilizing teos-based silicon oxide cap layer having reduced carbon content (2008-05-27),

4. 7214612 - Dual damascene structure and fabrication thereof (2007-05-08),

5. 7192878 - Method for removing post-etch residue from wafer surface (2007-03-20),

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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