IDiyas

For the Inventor, By the Inventor

Tainan, Taiwan

Cheng-Hung Tsai

USPTO Granted Patents = 26 


Average Co-Inventor Count = 4.7

ph-index = 4

Forward Citations = 106(Granted Patents)


Location History:

  • Hsinchu Hsien, TW (2006)
  • Changhua, TW (2010)
  • Taipei, TW (2022)
  • Hsinchu, TW (2006 - 2023)
  • Tainan, TW (2016 - 2023)
  • Kaohsiung, TW (2024)

Company Filing History:

goldMedal12 out of 1,056 
 
Himax Technologies, Inc.
 patents
silverMedal6 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
bronzeMedal5 out of 9,138 
 
Industrial Technology Research Institute
 patents
4. 2 out of 632 
 
Institute for Information Industry
 patents
5. 1 out of 51 
 
Elite Semiconductor Microelectronics Technology Inc.
 patents

Years Active: 2006-2025

where 'Filed Patents' based on already Granted Patents

26 patents (USPTO):
1. 12453168 - Semiconductor device with short-resistant capacitor plate (2025-10-21),
2. 11990524 - Semiconductor device and forming method thereof (2024-05-21),
3. 11782532 - Calibration method and calibration apparatus for knob applicable to touch panel (2023-10-10),
4. 11621263 - Semiconductor device with short-resistant capacitor plate (2023-04-04),
5. 11494038 - Touch panel (2022-11-08),
6. 11460947 - Touch screen (2022-10-04),
7. 11416089 - Knob device applicable to touch panel (2022-08-16),
8. 11264963 - Input buffer circuit (2022-03-01),
9. 11250837 - Speech synthesis system, method and non-transitory computer readable medium with language option selection and acoustic models (2022-02-15),
10. 11249587 - Touch panel and touch display apparatus (2022-02-15),
11. 11226692 - Knob device applicable to touch panel (2022-01-18),
12. 11221719 - Sensor pattern and capacitive touch screen (2022-01-11),
13. 11209919 - Knob device applicable to touch panel (2021-12-28),
14. 11127704 - Semiconductor device with bump structure and method of making semiconductor device (2021-09-21),
15. 11049490 - Audio playback device and audio playback method thereof for adjusting text to speech of a target character using spectral features (2021-06-29),

Title: The Innovative Journey of Inventor Cheng-Hung Tsai

Introduction:

Cheng-Hung Tsai, a talented inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Cheng-Hung Tsai's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to invention.

Career Highlights:

With a career spanning over two decades, Cheng-Hung Tsai has established himself as a pioneer in the tech industry, with numerous patents to his name that have revolutionized various sectors. His dedication to innovation and problem-solving has earned him recognition as a leading figure in the field.

Collaborations:

Throughout his career, Cheng-Hung Tsai has collaborated with top research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has led to the successful development and commercialization of cutting-edge technologies.

Conclusion:

Inventor Cheng-Hung Tsai's passion for innovation, coupled with his technical expertise and collaborative spirit, continues to drive him towards creating solutions that have a lasting impact on society. His journey as an inventor exemplifies the power of creativity and perseverance in shaping the future of technology.

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