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For the Inventor, By the Inventor

Zhongli, Taiwan

Chen-Yu Tsai

This inventor holds 19 USPTO granted patents and 3 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chen-Yu Tsai. Retrieved from https://idiyas.com/inventor/chen-yu-tsai-5h671e77

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 19 

% Patents Active = 84.2

Average Co-Inventor Count = 4.4

ph-index = 3

Forward Citations = 43(Granted Patents)


Location History:

  • Zhongli, TW (2014 - 2022)
  • Hsinchu, TW (2023 - 2024)

Company Filing History:

goldMedal19 out of 42,926 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

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Areas of Expertise:
Wafer Pre-Wetting
Semiconductor Structure
Bonding Structures
Plating Apparatus
Integrated Circuit Devices
Conformal Metal Cap
Redistribution Layer
Through Silicon Via
Alignment Mark
Protective Structure
Manufacturing Method
Device Package
19 patents (USPTO):Explore Patents
1. 12366004 - Apparatus and method for wafer pre-wetting (2025-07-22),
2. 12278203 - Semiconductor structure and manufacturing method thereof (2025-04-14),
3. 12237284 - Semiconductor structure comprising dummy feature interposed between the bonding connectors (2025-02-25),
4. 12227867 - Plating apparatus for plating semiconductor wafer and plating method (2025-02-18),
5. 12132016 - Bonding structures of integrated circuit devices and method forming the same (2024-10-29),
6. 11990430 - Bonding structures of integrated circuit devices and method forming the same (2024-05-21),
7. 11585008 - Plating apparatus for plating semiconductor wafer and plating method (2023-02-21),
8. 11585005 - Apparatus and method for wafer pre-wetting (2023-02-21),
9. 11488842 - Method of making semiconductor device package including conformal metal cap contacting each semiconductor die (2022-11-01),
10. 10510561 - Semiconductor device package including conformal metal cap contacting each semiconductor die (2019-12-17),
11. 10074595 - Self-alignment for redistribution layer (2018-09-11),
12. 9997497 - Through silicon via structure (2018-06-12),
13. 9786580 - Self-alignment for redistribution layer (2017-10-10),
14. 9633900 - Method for through silicon via structure (2017-04-25),
15. 9478480 - Alignment mark and method of formation (2016-10-25),

Title: Chen-Yu Tsai: Innovator from Zhongli, Taiwan

Introduction: Chen-Yu Tsai is a renowned inventor hailing from Zhongli, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chen-Yu Tsai holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Chen-Yu Tsai has worked with leading tech companies and research institutions, where he has spearheaded projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Chen-Yu Tsai has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge-sharing that has led to numerous successful projects and inventions.

Conclusion: Chen-Yu Tsai's passion for innovation, coupled with his dedication to creating impactful solutions, has solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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