The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2023

Filed:

Jan. 13, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chen-Yu Tsai, Hsinchu, TW;

Ku-Feng Yang, Hsinchu County, TW;

Wen-Chih Chiou, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/34 (2006.01); C25D 17/02 (2006.01); C25D 7/12 (2006.01); C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/34 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 17/02 (2013.01);
Abstract

A semiconductor apparatus and methods of processing a semiconductor workpiece are provided. The semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece comprising a plurality of recess portions.


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