Chao-Shun Hsu

This inventor holds 9 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2008-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chao-Shun Hsu. Retrieved from https://idiyas.com/inventor/chao-shun-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 (Patent Applications = 1)

% Patents Active = 88.9

Average Co-Inventor Count = 3.7

ph-index = 7

Forward Citations = 180(Granted Patents)

Location History:

Sansing Township, Yilan County, TW (2009)
I-Land County, TW (2008 - 2013)
San-Shin, TW (2009 - 2015)

Company Filing History:

9 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2008-2015

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8945998 - Programmable semiconductor interposer for electronic package and method of forming (2015-02-03),

2. 8704375 - Barrier structures and methods for through substrate vias (2014-04-22),

3. 8492872 - On-chip inductors with through-silicon-via fence for Q improvement (2013-07-23),

4. 8476735 - Programmable semiconductor interposer for electronic package and method of forming (2013-07-02),

5. 7812426 - TSV-enabled twisted pair (2010-10-12),

6. 7795735 - Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom (2010-09-14),

7. 7565635 - SiP (system in package) design systems and methods (2009-07-21),

8. 7494846 - Design techniques for stacking identical memory dies (2009-02-24),

9. 7427803 - Electromagnetic shielding using through-silicon vias (2008-09-23),

Title: Chao-Shun Hsu: Innovator in Semiconductor Technology

Introduction

Chao-Shun Hsu is a prominent inventor based in San-Shin, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His innovative work focuses on enhancing electronic packaging and semiconductor device structures.

Latest Patents

Hsu's latest patents include a programmable semiconductor interposer for electronic packages and methods of forming it. This invention describes various structures of a programmable semiconductor interposer that allows users to create a 'virtual' device with desired values by selectively connecting an array of semiconductor devices to contact pads on the interposer's surface. Additionally, he has developed barrier structures and methods for through substrate vias, which enhance the performance and reliability of semiconductor devices.

Career Highlights

Chao-Shun Hsu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the capabilities of electronic packaging and semiconductor device integration.

Collaborations

Hsu has collaborated with notable colleagues, including Mark Shane Peng and Clinton Chao, contributing to various innovative projects within the semiconductor field.

Conclusion

Chao-Shun Hsu's contributions to semiconductor technology exemplify the spirit of innovation. His patents and collaborative efforts continue to shape the future of electronic packaging and device integration.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: