The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 14, 2010
Filed:
Mar. 21, 2007
Chao-shun Hsu, San-Shin, TW;
Chen-yao Tang, Hsin-Chu, TW;
Clinton Chao, Hsinchu, TW;
Mark Shane Peng, Hsinchu, TW;
Chao-Shun Hsu, San-Shin, TW;
Chen-Yao Tang, Hsin-Chu, TW;
Clinton Chao, Hsinchu, TW;
Mark Shane Peng, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A method for forming a single die includes forming at least one first active device over a first substrate and at least one first metallic layer coupled to the first active device. At least one second metallic layer is formed over a second substrate, wherein the second substrate does not include any active device. The at least one first metallic layer is bonded with the at least one second metallic layer such that the first substrate and the second substrate constitute a single die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile