The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2008

Filed:

Sep. 22, 2006
Applicants:

Clinton Chao, Hsin-Chu, TW;

Chao-shun Hsu, I-Land County, TW;

Mark Shane Peng, Hsin-Chu, TW;

Szu Wei LU, Hsin-Chu, TW;

Tjandra Winata Karta, Chu-Pei, TW;

Inventors:

Clinton Chao, Hsin-Chu, TW;

Chao-Shun Hsu, I-Land County, TW;

Mark Shane Peng, Hsin-Chu, TW;

Szu Wei Lu, Hsin-Chu, TW;

Tjandra Winata Karta, Chu-Pei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

An isolation structure for electromagnetic interference includes a semiconductor substrate, a first integrated circuit in the semiconductor substrate, a second integrated circuit in the semiconductor substrate, and an isolation structure in a direct path between the first and the second integrated circuits, wherein the isolation structure comprises a through-silicon via.


Find Patent Forward Citations

Chao, Clinton. (2008). Electromagnetic shielding using through-silicon vias (U.S. Patent No. 7427803). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7427803

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…