Chang-Chia Huang

This inventor holds 22 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chang-Chia Huang. Retrieved from https://idiyas.com/inventor/chang-chia-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 (Patent Applications = 1)

% Patents Active = 72.7

Average Co-Inventor Count = 4.8

ph-index = 4

Forward Citations = 113(Granted Patents)

Company Filing History:

22 out of 42,926

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2013-2024

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Areas of Expertise:

Contact Pad

Semiconductor Device

Packaging Device

Copper Bump Structures

Conductive Contacts

Manufacturing Method

Fan-Out System

Bump-On-Trace

Integrated Circuit

Electrical Connection

Dummy Dies

22 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11901320 - Contact pad for semiconductor device (2024-02-13),

2. 11527502 - Contact pad for semiconductor device (2022-12-13),

3. 10930605 - Contact pad for semiconductor device (2021-02-23),

4. 10700033 - Packaging device and method of making the same (2020-06-30),

5. 10453813 - Contact pad for semiconductor device (2019-10-22),

6. 10050001 - Packaging device and method of making the same (2018-08-14),

7. 9978656 - Mechanisms for forming fine-pitch copper bump structures (2018-05-22),

8. 9953939 - Conductive contacts having varying widths and method of manufacturing same (2018-04-24),

9. 9786520 - Semiconductor device and manufacturing method thereof (2017-10-10),

10. 9691686 - Contact pad for semiconductor device (2017-06-27),

11. 9613931 - Fan-out stacked system in package (SIP) having dummy dies and methods of making the same (2017-04-04),

12. 9583367 - Methods and apparatus for bump-on-trace chip packaging (2017-02-28),

13. 9508668 - Conductive contacts having varying widths and method of manufacturing same (2016-11-29),

14. 9449933 - Packaging device and method of making the same (2016-09-20),

15. 9209046 - Semiconductor device and manufacturing method thereof (2015-12-08),

Title: Chang-Chia Huang: Pioneering Inventor from Hsin-Chu

Introduction: Chang-Chia Huang is a renowned inventor hailing from Hsin-Chu, Taiwan. His innovative spirit and dedication to technological advancements have made him a prominent figure in the world of patents and inventions.

Latest Patents: Chang-Chia Huang's latest patents focus on cutting-edge technologies in the fields of semiconductor manufacturing, renewable energy, and artificial intelligence. His inventions have significantly contributed to the advancement of these industries on a global scale.

Career Highlights: With a career spanning over two decades, Chang-Chia Huang has worked with leading research institutions and technology companies to bring his inventions to life. His expertise in patent applications and intellectual property rights has earned him recognition as a trailblazer in the field.

Collaborations: Throughout his career, Chang-Chia Huang has collaborated with top universities, research institutions, and multinational corporations to further his research and development efforts. His partnerships have led to groundbreaking innovations that have shaped the future of various industries.

Conclusion: Chang-Chia Huang's passion for innovation and his relentless pursuit of excellence have solidified his position as a visionary inventor. His contributions to the world of patents and inventions continue to inspire the next generation of inventors and researchers worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: