The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 08, 2015
Filed:
Oct. 02, 2013
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Yu-Chih Liu, Taipei, TW;
Chang-Chia Huang, Hsinchu, TW;
Shih-Yen Lin, New Taipei, TW;
Chin-Liang Chen, Kaohsiung, TW;
Kuan-Lin Ho, Hsinchu, TW;
Wei-Ting Lin, Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method of manufacturing a WLP semiconductor structure includes several operations. One of the operations is providing a carrier and the carrier includes a top surface. One of the operations is covering a portion of the top surface with a plurality of active dies. One of the operations is disposing a protrudent band on a periphery of the carrier, wherein the protrudent band includes a rim shaped along the contour of the carrier. One of the operations is forming a molding compound on the carrier to cover the plurality of active dies.