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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10050001 B1

PDFFull Text
Date of Patent:
Aug. 14, 2018

Filed:

Sep. 19, 2016

Packaging device and method of making the same

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chang-Chia Huang, Hsinchu, TW;

Tsung-Shu Lin, New Taipei, TW;

Ming-Da Cheng, Jhubei, TW;

Wen-Hsiung Lu, Jhonghe, TW;

Bor-Rung Su, New Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Attorney:

Eschweiler & Potashnik, LLC

Primary Examiner:

David Zarneke

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 23/538 (2006.01); H01L 21/28 (2006.01); H01L 21/302 (2006.01); H01L 23/00 (2006.01); H01L 23/482 (2006.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/565 (2013.01); H01L 23/4824 (2013.01); H01L 23/498 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 21/28 (2013.01); H01L 21/302 (2013.01); H01L 21/76895 (2013.01); H01L 23/48 (2013.01); H01L 23/538 (2013.01); H01L 24/04 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/056 (2013.01); H01L 2224/05556 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15311 (2013.01);
Abstract

The present disclosure relates to an integrated chip packaging device. In some embodiments, the packaging device has a first package component. A metal trace is arranged on a surface of the first package component. The metal trace has an undercut. A molding material fills the undercut of the metal trace and has a sloped outermost sidewall with a height that monotonically decreases from a position below a top surface of the metal trace to the surface of the first package component. A solder region is arranged over the metal trace.

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