The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Mar. 29, 2012
Chang-chia Huang, Hsinchu, TW;
Tsung-shu Lin, New Taipei, TW;
Ming-da Cheng, Jhubei, TW;
Wen-hsiung LU, Jhonghe, TW;
Bor-rung Su, New Taipei, TW;
Chang-Chia Huang, Hsinchu, TW;
Tsung-Shu Lin, New Taipei, TW;
Ming-Da Cheng, Jhubei, TW;
Wen-Hsiung Lu, Jhonghe, TW;
Bor-Rung Su, New Taipei, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A device includes a first and a second package component. A metal trace is disposed on a surface of the first package component. The metal trace has a lengthwise direction. The second package component includes a metal pillar, wherein the second package component is disposed over the first package component. A solder region bonds the metal pillar to the metal trace, wherein the solder region contacts a top surface of the metal trace.