Chandrika Prasad

This inventor holds 34 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: International Business Machines Corporation. Active years: 1983-2009.

USPTO Granted Patents = 34

% Patents Active = 91.2

Average Co-Inventor Count = 4.1

ph-index = 17

Forward Citations = 1,068(Granted Patents)

Location History:

Poughkeepsie, NY (US) (1983 - 1987)
Wappingers Falls, NY (US) (1995 - 2009)

Company Filing History:

34 out of 166,264

International Business Machines Corporation

patents

Years Active: 1983-2009

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Areas of Expertise:

Chip Integration

Wafer Connections

Thin Film Processes

CMOS-MEMS Devices

Electroplating

Multilevel Structures

Optoelectronic Chips

Interconnect Devices

Solder Interconnections

Electrical Connections

Direct Transfer

Metallization

34 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7564118 - Chip and wafer integration process using vertical connections (2009-07-21),

2. 7388277 - Chip and wafer integration process using vertical connections (2008-06-17),

3. 7049697 - Process for making fine pitch connections between devices and structure made by the process (2006-05-23),

4. 6998327 - Thin film transfer join process and multilevel thin film module (2006-02-14),

5. 6864165 - Method of fabricating integrated electronic chip with an interconnect device (2005-03-08),

6. 6856025 - Chip and wafer integration process using vertical connections (2005-02-15),

7. 6835589 - Three-dimensional integrated CMOS-MEMS device and process for making the same (2004-12-28),

8. 6737297 - Process for making fine pitch connections between devices and structure made by the process (2004-05-18),

9. 6724203 - Full wafer test configuration using memory metals (2004-04-20),

10. 6678949 - Process for forming a multi-level thin-film electronic packaging structure (2004-01-20),

11. 6669833 - Process and apparatus for electroplating microscopic features uniformly across a large substrate (2003-12-30),

12. 6640021 - Fabrication of a hybrid integrated circuit device including an optoelectronic chip (2003-10-28),

13. 6632314 - Method of making a lamination and surface planarization for multilayer thin film interconnect (2003-10-14),

14. 6600224 - Thin film attachment to laminate using a dendritic interconnection (2003-07-29),

15. 6599778 - Chip and wafer integration process using vertical connections (2003-07-29),

Title: Chandrika Prasad - Pioneering Inventor from Wappingers Falls

Introduction: Chandrika Prasad is a highly accomplished inventor based in Wappingers Falls, NY. She is known for her groundbreaking innovations in various fields.

Latest Patents: Chandrika Prasad holds several patents in the areas of technology, healthcare, and sustainable energy. Her most recent patents focus on enhancing communication systems and improving medical devices.

Career Highlights: With a career spanning over two decades, Chandrika Prasad has consistently pushed the boundaries of innovation. She has received numerous awards for her contributions to the field of technology and has been recognized as a thought leader in the industry.

Collaborations: Throughout her career, Chandrika Prasad has collaborated with leading research institutions, universities, and tech companies to bring her inventions to life. Her ability to work across disciplines has led to the development of cutting-edge solutions.

Conclusion: Chandrika Prasad's dedication to innovation and her passion for creating a positive impact on society through her inventions make her a true trailblazer in the world of technology. Her work continues to inspire the next generation of inventors.

Profile summary based on public USPTO records.

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