The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 14, 2006
Filed:
Nov. 19, 2002
Jeffrey B. Danielson, Poughkeepsie, NY (US);
Balaram Ghosal, Fishkill, NY (US);
James Kuss, Claverack, NY (US);
Matthew Wayne Oonk, Poughkeepsie, NY (US);
Chandrika Prasad, Wappingers Falls, NY (US);
Eric Daniel Perfecto, Poughkeepsie, NY (US);
Roy Yu, Poughkeepsie, NY (US);
Jeffrey B. Danielson, Poughkeepsie, NY (US);
Balaram Ghosal, Fishkill, NY (US);
James Kuss, Claverack, NY (US);
Matthew Wayne Oonk, Poughkeepsie, NY (US);
Chandrika Prasad, Wappingers Falls, NY (US);
Eric Daniel Perfecto, Poughkeepsie, NY (US);
Roy Yu, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A thin film transfer join process in which a multilevel thin film structure is formed on a carrier, the multilevel thin film structure is joined to a final substrate and then the carrier is removed. Once the carrier is removed, the dielectric material and metallic material that were once joined to the carrier are now exposed. The dielectric material is then etched back so that the exposed metallic material protrudes beyond the dielectric material. Also disclosed is a module made by the foregoing process.