Jeffrey B Danielson

Title: The Innovations of Jeffrey B. Danielson

Introduction

Jeffrey B. Danielson is a notable inventor based in Poughkeepsie, NY (US). He has made significant contributions to the field of thin film technology. His innovative work has led to the development of a unique patent that enhances the efficiency of thin film structures.

Latest Patents

Danielson holds a patent for a "Thin film transfer join process and multilevel thin film module." This process involves forming a multilevel thin film structure on a carrier, which is then joined to a final substrate. After the carrier is removed, the dielectric and metallic materials are exposed. The dielectric material is etched back, allowing the metallic material to protrude beyond it. This innovative method not only improves the manufacturing process but also enhances the functionality of the resulting modules.

Career Highlights

Danielson is associated with International Business Machines Corporation (IBM), where he has been instrumental in advancing thin film technologies. His work has been recognized for its potential applications in various electronic devices. With a focus on innovation, he continues to contribute to the field through his research and development efforts.

Collaborations

Throughout his career, Danielson has collaborated with esteemed colleagues such as Balaram Ghosal and James Kuss. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Jeffrey B. Danielson's contributions to thin film technology exemplify the spirit of innovation. His patent and work at IBM highlight the importance of advancements in this field. As he continues to push the boundaries of technology, his impact on the industry remains significant.