The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2003
Filed:
Oct. 31, 2000
Donald S. Farquhar, Endicott, NY (US);
Raymond T. Galasco, Vestal, NY (US);
Sung Kwon Kang, Chappaqua, NY (US);
Mark D. Poliks, Vestal, NY (US);
Chandrika Prasad, Wappingers Falls, NY (US);
Roy Yu, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic interconnection assembly having a thin film bonded to either a glass ceramic or to an organic laminate substrate, and a method for attaching a thin film wiring package to the substrate. Provided is the utilization of adhesives which may be processed at significantly lower temperatures so as to avoid damaging components, the wiring package and interconnection joints. Moreover, pursuant to specific aspects, the joining of the thin film to the substrate may be implemented with the utilization of dendrites.