Brian J Coppa

USPTO Granted Patents = 13 (Patent Applications = 1)

Average Co-Inventor Count = 4.6

ph-index = 5

Forward Citations = 151(Granted Patents)

Location History:

Boise, ID (US) (2012 - 2019)
Eagle, ID (US) (2019 - 2022)
Tempe, AZ (US) (2016 - 2024)

Company Filing History:

7 out of 37,905

Micron Technology Incorporated

patents

4 out of 10,295

Tokyo Electron Limited

patents

where one patent can have more than one assignee

Years Active: 2012-2025

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12463044 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2025-11-04),

2. 11935756 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2024-03-19),

3. 11335563 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2022-05-17),

4. 11273469 - Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy (2022-03-15),

5. 10773282 - Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy (2020-09-15),

6. 10607844 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2020-03-31),

7. 10446453 - Surface modification control for etch metric enhancement (2019-10-15),

8. 10304668 - Localized process control using a plasma system (2019-05-28),

9. 10096483 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2018-10-09),

10. 9761457 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2017-09-12),

11. 9305782 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2016-04-05),

12. 8852851 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same (2014-10-07),

13. 8129289 - Method to deposit conformal low temperature SiO2 (2012-03-06),

Title: The Innovator Behind Advanced Semiconductor Technologies: Brian J. Coppa

Introduction: Brian J. Coppa is a prominent inventor based in Tempe, Arizona, with a remarkable portfolio of 12 patents to his name. His contributions to the field of semiconductor technology reflect his commitment to pushing the boundaries of innovation. His work has significantly advanced the capabilities of semiconductor devices, making them more efficient and effective.

Latest Patents: Among Brian's latest contributions is a groundbreaking patent titled "Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same." This innovative method enhances the density of features formed over an initial patterning layer by utilizing a series of self-aligned spacers. The process involves providing a layer to be etched, followed by the formation of an initial sacrificial patterning layer—typically through optical lithography. Depending on the embodiment, this layer may undergo trimming before a series of spacer layers are formed and etched, with the number and dimensions of these layers depending on the desired feature density. The patent also describes an in-process semiconductor device and electronic system, showcasing the practical applications of his innovative techniques.

Career Highlights: Brian J. Coppa has worked with esteemed companies such as Micron Technology Incorporated and Tokyo Electron Limited, where he has contributed to several cutting-edge projects in semiconductor technology. His dedication to research and development has positioned him as a leader in his field.

Collaborations: Throughout his career, Brian has collaborated with notable professionals, including Baosuo Zhou and Mirzafer K. Abatchev. These collaborations have played a vital role in fostering innovation and advancing semiconductor technologies, allowing for the exchange of ideas and expertise.

Conclusion: Brian J. Coppa's innovative spirit and dedication to the semiconductor industry have led to significant advancements in technology. With his impressive portfolio of patents and collaborative efforts, he continues to be an influential figure in driving the evolution of semiconductor devices and systems. His work exemplifies the power of innovation in shaping the future of technology.

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