Growing community of inventors

Tempe, AZ, United States of America

Brian J Coppa

Average Co-Inventor Count = 4.71

ph-index = 6

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 161

Brian J CoppaMirzafer K Abatchev (8 patents)Brian J CoppaPaul A Morgan (8 patents)Brian J CoppaArdavan Niroomand (8 patents)Brian J CoppaBaosuo Zhou (8 patents)Brian J CoppaShuang Meng (7 patents)Brian J CoppaJoseph Neil Greeley (7 patents)Brian J CoppaDeepak Vedhachalam (2 patents)Brian J CoppaFrancois Chandrasekar Dassapa (2 patents)Brian J CoppaShuang Meng (2 patents)Brian J CoppaGurtej S Sandhu (1 patent)Brian J CoppaJohn A Smythe (1 patent)Brian J CoppaShyam Surthi (1 patent)Brian J CoppaSeiichi Watanabe (1 patent)Brian J CoppaKenji Komatsu (1 patent)Brian J CoppaVaidya Bharadwaj (1 patent)Brian J CoppaViswas Purohit (1 patent)Brian J CoppaJoseph Neil Greely (1 patent)Brian J CoppaBrian J Coppa (13 patents)Mirzafer K AbatchevMirzafer K Abatchev (56 patents)Paul A MorganPaul A Morgan (54 patents)Ardavan NiroomandArdavan Niroomand (45 patents)Baosuo ZhouBaosuo Zhou (36 patents)Shuang MengShuang Meng (37 patents)Joseph Neil GreeleyJoseph Neil Greeley (34 patents)Deepak VedhachalamDeepak Vedhachalam (3 patents)Francois Chandrasekar DassapaFrancois Chandrasekar Dassapa (3 patents)Shuang MengShuang Meng (2 patents)Gurtej S SandhuGurtej S Sandhu (1,435 patents)John A SmytheJohn A Smythe (145 patents)Shyam SurthiShyam Surthi (69 patents)Seiichi WatanabeSeiichi Watanabe (5 patents)Kenji KomatsuKenji Komatsu (3 patents)Vaidya BharadwajVaidya Bharadwaj (2 patents)Viswas PurohitViswas Purohit (1 patent)Joseph Neil GreelyJoseph Neil Greely (1 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (7 from 37,972 patents)

2. Tokyo Electron Limited (4 from 10,326 patents)


13 patents:

1. 12463044 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

2. 11935756 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

3. 11335563 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

4. 11273469 - Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy

5. 10773282 - Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy

6. 10607844 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

7. 10446453 - Surface modification control for etch metric enhancement

8. 10304668 - Localized process control using a plasma system

9. 10096483 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

10. 9761457 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

11. 9305782 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

12. 8852851 - Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same

13. 8129289 - Method to deposit conformal low temperature SiO2

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12/25/2025
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