Palo Alto, CA, United States of America

Brian J Brown

This inventor holds 80 USPTO granted patents and 38 published patent applications and 1 EPO patent, primarily in Chemical Mechanical Polishing (CPC class H01L). Top assignees: Applied Materials, Inc., Alta Devices, Inc., Novellus Systems Incorporated. Active years: 2000-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian J Brown. Retrieved from https://idiyas.com/inventor/brian-j-brown-r19tgbnz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 80 

% Patents Active = 82.5

 

Average Co-Inventor Count = 3.3

ph-index = 12

Forward Citations = 422(Granted Patents)

Forward Citations (Not Self Cited) = 397(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Oakland, CA (US) (2016 - 2017)
  • Palo Alto, CA (US) (2000 - 2024)

Company Filing History:


Years Active: 2000-2026

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Areas of Expertise:
Chemical Mechanical Polishing
Substrate Cleaning
Temperature Control
Wafer Polishing
High Throughput Systems
Edge Asymmetry Correction
Surface Cleaning
Rinsing Systems
Modular Polishing
Piezoelectric Control
Grooving Conditioning
Epitaxial Lift Off
80 patents (USPTO):Explore Patents

Title: Brian J Brown: Revolutionizing Industries with Advanced Robotics Systems

Introduction:

Brian J Brown has made significant contributions to the field of advanced robotics systems, earning him recognition and accolades throughout his career. With expertise in machine learning, he has spearheaded groundbreaking innovations that have revolutionized industries like manufacturing and healthcare. This article explores his latest patents, career highlights, collaborations, and the impact of his inventive work.

Latest Patents:

1. Asymmetry Correction via Variable Relative Velocity of a Wafer:

This patent introduces a method for removing material on a substrate, involving rotating the substrate in two different directions at varying rotation rates. By employing this technique, manufacturing processes can achieve precise polishing and surface uniformity.

2. Cleaning System with In-Line SPM Processing:

In this patent, Brown presents a cleaning system that processes substrates after polishing. The system includes a Sulfuric Peroxide Mix (SPM) module, several cleaning elements, and multiple robots. The SPM module incorporates a SPM cleaner with containers for holding the cleaning liquid and substrates, while the cleaning elements offer various methods for cleaning and drying the substrates.

Career Highlights:

Brian J Brown has amassed an impressive portfolio of 56 patents over the course of his career. He has always been at the forefront of robotics advancements and has made significant contributions to the field. Notably, he has worked with renowned companies such as Applied Materials, Inc. and Alta Devices, Inc., propelling novel technologies that have redefined industries.

Collaborations:

Throughout his career, Brown has collaborated with talented individuals, fostering innovation and pushing boundaries in the field of robotics. Notable colleagues include Boris Fishkin and Jianshe Tang, who have contributed to joint projects and research endeavors. Their combined expertise and dedication have resulted in groundbreaking developments that continue to shape the future of robotics.

Conclusion:

Inventor Brian J Brown has left an indelible mark in the robotics landscape, revolutionizing multiple industries with his inventive work. His expertise in machine learning, coupled with his relentless pursuit of innovation, has resulted in numerous patents that address critical challenges. Brown's collaborations with talented colleagues and his association with prestigious companies have further strengthened his impact on the field. As we look to the future, it is evident that Brian J Brown's inventive contributions will continue to shape and transform the world of robotics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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