The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Oct. 06, 2023
Applied Materials, Inc., Santa Clara, CA (US);
Zhize Zhu, Cupertino, CA (US);
Brian J. Brown, Palo Alto, CA (US);
Christopher Heung-Gyun Lee, San Jose, CA (US);
Huyen Tran, San Jose, CA (US);
Huanbo Zhang, Santa Clara, CA (US);
Eric Lau, Santa Clara, CA (US);
Ekaterina A. Mikhaylichenko, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method for chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, dispensing a polishing liquid onto the polishing pad, and oscillating the substrate laterally across the polishing pad. The polishing pad has a polishing-rate adjustment groove that is concentric with the axis of rotation, and a coolant, a dilutant, or both, is dispensed into the polishing-rate adjustment groove such that a polishing rate is reduced in an annular zone of the polishing pad that is positioned radially inward of the polishing-rate adjustment groove. The annular zone surrounds a central zone of the polishing pad in which a polishing rate is not substantially affected by the coolant, dilutant, or both.