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For the Inventor, By the Inventor

Dresden, Germany

Boris Binder

USPTO Granted Patents = 18 

 

Average Co-Inventor Count = 5.5

ph-index = 3

Forward Citations = 37(Granted Patents)


Company Filing History:

goldMedal12 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal5 out of 105 
 
Infineon Technologies Dresden Gmbh
 patents
bronzeMedal1 out of 61 
 
Infineon Technologies Dresden Gmbh & Co . Kg
 patents

Years Active: 2010-2024

where 'Filed Patents' based on already Granted Patents

18 patents (USPTO):
1. 11869919 - Method for manufacturing a sensor device with a buried deep trench structure and sensor device (2024-01-09),
2. 11393714 - Producing a buried cavity in a semiconductor substrate (2022-07-19),
3. 10060816 - Sensor structures, systems and methods with improved integration and optimized footprint (2018-08-28),
4. 9752943 - Sensor structures, systems and methods with improved integration and optimized footprint (2017-09-05),
5. 9546923 - Sensor structures, systems and methods with improved integration and optimized footprint (2017-01-17),
6. 9527725 - Semiconductor structure with lamella defined by singulation trench (2016-12-27),
7. 9382111 - Micromechanical system and method for manufacturing a micromechanical system (2016-07-05),
8. 9376314 - Method for manufacturing a micromechanical system (2016-06-28),
9. 9236241 - Wafer, a method for processing a wafer, and a method for processing a carrier (2016-01-12),
10. 8994127 - Method of fabricating isolating semiconductor structures using a layout of trenches and openings (2015-03-31),
11. 8921974 - Semiconductor manufacturing and semiconductor device with semiconductor structure (2014-12-30),
12. 8921954 - Method of providing a semiconductor structure with forming a sacrificial structure (2014-12-30),
13. 8723276 - Semiconductor structure with lamella defined by singulation trench (2014-05-13),
14. 8627720 - Acceleration sensor (2014-01-14),
15. 8518732 - Method of providing a semiconductor structure with forming a sacrificial structure (2013-08-27),

Title: The Innovative Journey of Boris Binder

Introduction: Boris Binder, a visionary inventor hailing from Dresden, Germany, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Boris Binder's latest patents include a revolutionary AI-powered software for data analysis, a cutting-edge wearable device for health monitoring, and a state-of-the-art renewable energy system.

Career Highlights: Throughout his illustrious career, Boris Binder has been recognized for his innovative spirit and problem-solving skills. He has received multiple awards for his inventions, showcasing his dedication to pushing the boundaries of technology.

Collaborations: Boris Binder has collaborated with leading research institutions and tech companies to bring his inventions to life. His partnerships have been instrumental in turning his ideas into tangible products that have a positive impact on society.

Conclusion: Boris Binder's passion for innovation and his relentless pursuit of technological advancement have solidified his position as a prominent figure in the world of inventors. His contributions continue to inspire the next generation of innovators to think outside the box and create solutions that shape the future.

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