The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 27, 2016
Filed:
Apr. 16, 2014
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Boris Binder, Dresden, DE;
Bernd Foeste, Dresden, DE;
Thoralf Kautzsch, Dresden, DE;
Stefan Kolb, Unterschleissheim, DE;
Marco Mueller, Pirna, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81C 1/00 (2006.01); G01L 9/00 (2006.01); G01L 13/02 (2006.01); G01L 15/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0015 (2013.01); G01L 9/0052 (2013.01); G01L 9/0073 (2013.01); G01L 9/0098 (2013.01); G01L 13/025 (2013.01); G01L 15/00 (2013.01);
Abstract
A method for fabricating a semiconductor structure includes etching a first opening into a substrate; etching a chip singulation trench into the substrate to define a lamella between the first opening and the chip singulation trench; fabricating a sense element for sensing a deflection of the lamella; and singulating the semiconductor structure at the chip singulation trench.