The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2016
Filed:
Jun. 26, 2014
Applicant:
Infineon Technologies Dresden Gmbh, Dresden, DE;
Inventors:
Thoralf Kautzsch, Dresden, DE;
Heiko Froehlich, Radebeul, DE;
Mirko Vogt, Dresden, DE;
Maik Stegemann, Pesterwitz, DE;
Boris Binder, Dresden, DE;
Assignee:
Infineon Technologies Dresden GmbH, Dresden, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/20 (2006.01); H01L 29/84 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00246 (2013.01); B81B 7/008 (2013.01); B81B 2201/0264 (2013.01);
Abstract
A method for manufacturing a micromechanical system includes forming in a Front-End-of-Line (FEOL) process transistors in a transistor region; after the FEOL-process, forming a sacrificial layer; structuring the sacrificial layer to form a structured sacrificial layer; forming a functional layer at least partially covering the structured sacrificial layer; and removing the sacrificial layer to create a cavity.