Bor Chiuan Hsieh

This inventor holds 20 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Fabrication. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bor Chiuan Hsieh. Retrieved from https://idiyas.com/inventor/bor-chiuan-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 (Patent Applications = 9)

% Patents Active = 75.0

Average Co-Inventor Count = 4.8

ph-index = 5

Forward Citations = 83(Granted Patents)

Location History:

Taoyuan County, TW (2015)
Taoyuan, TW (2011 - 2023)

Company Filing History:

20 out of 42,872

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2011-2025

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Areas of Expertise:

Self-Aligned Contacts

FinFETs

Seamless Gap Fill

Metal-to-Source Plugs

Dual EPI Process

CMOS Structure

Trench Isolation

ILD Gap-Fill Window

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12417948 - Hybrid film scheme for self-aligned contact (2025-09-16),

2. 12302595 - Dummy hybrid film for self-alignment contact formation (2025-05-13),

3. 12293947 - Gap patterning for metal-to-source/drain plugs in a semiconductor device (2025-05-06),

4. 12211924 - Semiconductor device and method of forming the same (2025-01-28),

5. 11842930 - Gap patterning for metal-to-source/drain plugs in a semiconductor device (2023-12-12),

6. 11798984 - Seamless gap fill (2023-10-24),

7. 11355399 - Gap patterning for metal-to-source/drain plugs in a semiconductor device (2022-06-07),

8. 11239310 - Seamless gap fill (2022-02-01),

9. 10672866 - Seamless gap fill (2020-06-02),

10. 10510867 - FinFETs and methods of forming the same (2019-12-17),

11. 10157997 - FinFETs and methods of forming the same (2018-12-18),

12. 10084040 - Seamless gap fill (2018-09-25),

13. 9437712 - High performance self aligned contacts and method of forming same (2016-09-06),

14. 9218974 - Sidewall free CESL for enlarging ILD gap-fill window (2015-12-22),

15. 8999834 - Sidewall-free CESL for enlarging ILD gap-fill window (2015-04-07),

Title: Bor Chiuan Hsieh: Pioneering Inventor from Taoyuan

Introduction: Bor Chiuan Hsieh is a renowned inventor hailing from Taoyuan, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Bor Chiuan Hsieh holds several patents in the areas of electronics, semiconductor technology, and renewable energy, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Bor Chiuan Hsieh has worked with leading tech companies, research institutions, and universities, where he has played a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Bor Chiuan Hsieh has collaborated with top inventors, patent attorneys, and research institutions globally, fostering a culture of innovation and knowledge sharing that has led to numerous breakthroughs in the tech sector.

Conclusion: Bor Chiuan Hsieh's passion for innovation, coupled with his relentless drive to create a positive impact through his inventions, solidifies his position as a trailblazer in the world of technology and a source of inspiration for aspiring inventors worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

9 patents pending: