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For the Inventor, By the Inventor

Folsom, CA, United States of America

Boping Wu

USPTO Granted Patents = 7 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Seattle, WA (US) (2010)
  • King of Prussia, PA (US) (2016 - 2017)
  • Folsom, CA (US) (2014 - 2020)

Company Filing History:

goldMedal7 out of 54,688 
 
Intel Corporation
 patents

Years Active: 2010-2020

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7 patents (USPTO):Explore Patents
1. 10763218 - Electrical devices and methods for forming electrical devices (2020-09-01),
2. 10015878 - Decoupling arrangement (2018-07-03),
3. 9750129 - Absorbing termination in an interconnect (2017-08-29),
4. 9485854 - Absorbing termination in an interconnect (2016-11-01),
5. 9225164 - Decoupling arrangement (2015-12-29),
6. 8913364 - Decoupling arrangement (2014-12-16),
7. 7649265 - Micro-via structure design for high performance integrated circuits (2010-01-19),
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