Intel Corporation

Boping Wu

Andrew Paul Collins

Isaac Ali

Colin Leslie Perry

William L Barber

Keith Pinson

Kai Xiao

Xiaoning Ye

Beom-Taek Lee

Shaowu Huang

Chunfei Ye

Sruti Chigullapalli

Leslie Fitch

An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.

Electrical devices and methods for forming electrical devices

In various embodiments, apparatuses and methods are disclosed that may be able to implement a multi-layer, three dimensional routing between a decoupling component and an input port for a SoC or MCM. A three dimensional (3D) structure may provide a defined current return path from the decoupling component to the input port. The current return path may be constrained by design to provide an equal and opposite electromagnetic flux to the input port thereby reducing series inductance between the input port and the decoupling component.

Decoupling arrangement

Embodiments of the present disclosure are directed toward techniques and configurations for electrical signal absorption in an interconnect disposed in a printed circuit board (PCB) assembly. In one instance, a PCB assembly may comprise a substrate, and an interconnect formed in the substrate to route an electrical signal within the PCB. The interconnect may be coupled with a connecting component that is disposed on a surface of the PCB. An absorbing material may be disposed on the PCB to be in direct contact with at least a portion of the connecting component to at least partially absorb a portion of the electrical signal. Other embodiments may be described and/or claimed.

Absorbing termination in an interconnect

In some embodiments, a micro-via structure design for high performance integrated circuits is presented. In this regard, an integrated circuit chip package is introduced having a dielectric layer, a plated throughhole in the dielectric layer, and a micro-via coupled with the plated throughhole, wherein the micro-via forms a path around an axis. Other embodiments are also disclosed and claimed.

Micro-via structure design for high performance integrated circuits

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Folsom, CA, United States of America

Boping Wu