The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2020

Filed:

Mar. 24, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Sruti Chigullapalli, Chandler, AZ (US);

Leslie Fitch, Chandler, AZ (US);

Boping Wu, Folsom, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/60 (2006.01); H01L 23/10 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H05K 9/00 (2006.01); H05K 7/20 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/10 (2013.01); H01L 23/367 (2013.01); H01L 23/60 (2013.01); H01L 25/065 (2013.01); H05K 7/20409 (2013.01); H05K 9/0015 (2013.01); H05K 9/0032 (2013.01); H01L 23/42 (2013.01); H01L 23/49827 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73253 (2013.01);
Abstract

An electrical device includes at least one electrical component arranged on a carrier substrate and sidewalls of an electromagnetic shielding encapsulation arranged on the carrier substrate. The sidewalls of the electromagnetic shielding encapsulation laterally surround the at least one electrical component. Further, the electrical device includes a heat sink mounted to the sidewalls of the electromagnetic shielding encapsulation. The heat sink forms a cap of the electromagnetic shielding encapsulation and the heat sink includes surface-enlarging structures at a front side of the heat sink.


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