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Tainan, Taiwan

Bo-Jr Huang

This inventor holds 10 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2015-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo-Jr Huang. Retrieved from https://idiyas.com/inventor/bo-jr-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 80.0

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal10 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2023

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10 patents (USPTO):Explore Patents
1. 11715668 - Integrated antenna on interposer substrate (2023-08-01),
2. 11075116 - Integrated antenna on interposer substrate (2021-07-27),
3. 10692763 - Integrated antenna on interposer substrate (2020-06-23),
4. 10163708 - Integrated antenna on interposer substrate (2018-12-25),
5. 9779990 - Integrated antenna on interposer substrate (2017-10-03),
6. 9714979 - Contactless signal testing (2017-07-25),
7. 9423452 - Contactless signal testing (2016-08-23),
8. 9391010 - Power line filter for multidimensional integrated circuits (2016-07-12),
9. 9117796 - Semiconductor arrangement and formation thereof (2015-08-25),
10. 8937512 - Voltage-controlled oscillator (2015-01-20),

Title: Innovative Contributions of Bo-Jr Huang to Semiconductor Technology

Introduction: Bo-Jr Huang is a notable inventor based in Tainan, Taiwan, with a significant track record of 10 patents. He has made considerable advancements in semiconductor technologies, particularly in the integration of antennas within semiconductor modules. His work has helped push the boundaries of innovation in the electronics field.

Latest Patents: Among Bo-Jr Huang's latest inventions are two significant patents related to integrated antennas on interposer substrates. The first patent describes a semiconductor module that features an excitable element positioned on one side of the substrate, complemented by a ground structure designed to enhance its performance. The second patent introduces an integrated antenna structure that utilizes a radiator and ground plane configuration to improve electromagnetic efficiency, demonstrating Huang’s expertise in miniaturized semiconductor technology.

Career Highlights: Bo-Jr Huang is affiliated with Taiwan Semiconductor Manufacturing Company Limited, one of the largest and most advanced semiconductor fabrication companies in the world. His work contributes to the cutting-edge developments in semiconductor technology, which are transformative for various applications in consumer electronics, telecommunications, and beyond.

Collaborations: Throughout his career, Bo-Jr Huang has collaborated with esteemed colleagues, including Chin-Chou Liu and William Wu Shen, enhancing the collaborative spirit in the innovation process within his company. These partnerships not only support the development of new technologies but also elevate the collective expertise in the field.

Conclusion: Bo-Jr Huang's dedication to innovation in semiconductor technology is evident through his numerous patents and contributions to Taiwan Semiconductor Manufacturing Company Limited. His work continues to inspire advancements in the field and showcases the significant role of inventors in driving technological progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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