The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Jun. 19, 2020
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Bo-Jr Huang, Tainan, TW;
William Wu Shen, Hsinchu, TW;
Chin-Her Chien, Chung-Li, TW;
Chin-Chou Liu, Xinfeng Township, TW;
Yun-Han Lee, Baoshan Township, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/48 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 9/0407 (2013.01); H01L 23/481 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15788 (2013.01);
Abstract
The present disclosure relates to an integrated antenna structure. The integrated antenna structure includes a radiator and a ground plane disposed between a semiconductor substrate and the radiator. A conductive structure is separated from the ground plane by the semiconductor substrate. The conductive structure is electrically coupled to the ground plane. The semiconductor substrate has a thickness of less than approximately 100 microns.