The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Sep. 20, 2017
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Bo-Jr Huang, Tainan, TW;
William Wu Shen, Hsinchu, TW;
Chin-Her Chien, Chung-Li, TW;
Chin-Chou Liu, Jhubei, TW;
Yun-Han Lee, Baoshan Township, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01); H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 9/04 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 9/0407 (2013.01); H01L 23/481 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/157 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15788 (2013.01);
Abstract
Some embodiments relate to a semiconductor module having an integrated antenna structure. The semiconductor module has an excitable element and a first ground plane disposed between a substrate and the excitable element. A second ground plane is separated from the first ground plane by the substrate. The second ground plane is coupled to the first ground plane by one or more through-substrate vias (TSVs) that extend through the substrate.