IDiyas

For the Inventor, By the Inventor

Hong Kong, China

Bin Xie

USPTO Granted Patents = 8

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 32(Granted Patents)


Company Filing History:

goldMedal8 out of 582 
 
Hong Kong Applied Science and Technology Research Institute Company, Limited
 patents

Years Active: 2011-2022

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8 patents (USPTO):Explore Patents
1. 11407322 - Smart power hub (2022-08-09),
2. 9075941 - Method for optimizing electrodeposition process of a plurality of vias in wafer (2015-07-07),
3. 8791578 - Through-silicon via structure with patterned surface, patterned sidewall and local isolation (2014-07-29),
4. 8754507 - Forming through-silicon-vias for multi-wafer integrated circuits (2014-06-17),
5. 8674482 - Semiconductor chip with through-silicon-via and sidewall pad (2014-03-18),
6. 8544165 - Apparatus for aligning electronic components (2013-10-01),
7. 8138577 - Pulse-laser bonding method for through-silicon-via based stacking of electronic components (2012-03-20),
8. 7879438 - Substrate warpage-reducing structure (2011-02-01),

Title: Innovations of Bin Xie

Introduction

Bin Xie is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of technology, holding a total of 8 patents. His work focuses on optimizing processes and developing smart devices that enhance efficiency and functionality.

Latest Patents

One of his latest inventions is the Smart Power Hub. This innovative device features an AC port, a first DC port for car batteries, a second DC port for DC devices such as car instruments, and a third DC port for solar panels or another smart power hub. The design includes an AC bi-directional converter with six transistors in a B6 configuration, which converts three-phase AC and acts as an interleaved totem-pole Power-Factor-Corrector for one-phase AC. Additionally, a switch connects the DC bi-directional converter with either the AC bi-directional converter or the solar panels on the third DC port. The device also incorporates a link capacitor that raises the DC link voltage during battery charging, and a DC bi-directional converter that includes a transformer and bridges to power on-board DC devices.

Another notable patent is the method for optimizing the electrodeposition process of a plurality of vias in a wafer. This invention provides a method that selects a representative via with the maximum value of a critical factor, which is a function of process parameters. By simulating the filling of this representative via with different sampling points, the method aims to find optimized process windows for the parameters involved. An optimizer is disclosed that can either provide or reduce sampling points using an artificial neural network method. This innovation significantly shortens the simulation time for via filling while ensuring high accuracy in the process window.

Career Highlights

Bin Xie is currently associated with the Hong Kong Applied Science and Technology Research Institute Company, Limited. His work at this institution has allowed him to push the boundaries of technology and contribute to advancements in various fields.

Collaborations

He has collaborated with notable colleagues, including Xunqing Shi and Chang Hwa Chung, to further enhance his research and development efforts.

Conclusion

Bin Xie's innovative contributions to technology, particularly in the areas of smart devices and process optimization, highlight his role as a leading inventor in Hong Kong. His patents reflect a commitment to advancing technology and improving efficiency in various applications.

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