Arnab Roy

Title: Understanding the Innovations of Inventor Arnab Roy

Introduction

Arnab Roy, a prominent inventor based in Chandler, AZ, has made significant contributions to the field of technology with a remarkable portfolio of seven patents. His work primarily focuses on advanced packaging structures and interconnect technologies, which are crucial for the continuous evolution of electronic devices.

Latest Patents

Among Arnab Roy's latest innovations are two noteworthy patents. The first patent, titled "Via structures having tapered profiles for embedded interconnect bridge substrates," encompasses a package structure that integrates one or more layers of dielectric material. This invention features an embedded interconnect bridge substrate, with via structures positioned on the first surface. Each via structure comprises a conductive material and boasts a tapered profile, ensuring seamless connectivity.

The second patent, "Via-trace structures," introduces innovative via-trace designs with enhanced alignment. This patent describes a package substrate that includes a conductive trace and a conductive via in contact with this trace. Notably, the alignment offset between the conductive trace and the conductive via is less than 10 microns, while the geometry of the conductive trace may exhibit a bell-shaped cross-section or a flared shape for the conductive via, optimizing performance in computing devices.

Career Highlights

Arnab has built a reputable career within prestigious organizations, including Intel Corporation. His work at Intel has been instrumental in driving advancements in technology and has positioned him as a valuable contributor to the industry. Throughout his career, he has developed cutting-edge solutions that enhance the functionality and efficiency of electronic devices.

Collaborations

In addition to his impressive patents, Arnab Roy has worked alongside esteemed colleagues, including Jeremy D Ecton and Oscar Ojeda. Their collaborative efforts have fostered innovation and have led to developments that push the boundaries of electronic packaging technology.

Conclusion

Arnab Roy's inventive spirit and dedication to enhancing technology are reflected in his substantial patent portfolio. With his latest innovations focused on improving interconnect structures and alignment in electronic devices, he continues to pave the way for advancements that are essential in today's fast-paced technological landscape. His contributions not only benefit the companies he has worked with, such as Intel Corporation, but also represent significant strides in the broader field of electronics.