The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2023
Filed:
May. 24, 2022
Intel Corporation, Santa Clara, CA (US);
Jeremy D. Ecton, Gilbert, AZ (US);
Hiroki Tanaka, Chandler, AZ (US);
Oscar Ojeda, Chandler, AZ (US);
Arnab Roy, Chandler, AZ (US);
Vahidreza Parichehreh, Gilbert, AZ (US);
Leonel R. Arana, Phoenix, AZ (US);
Chung Kwang Tan, Chandler, AZ (US);
Robert A. May, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments include a package structure with one or more layers of dielectric material, where an interconnect bridge substrate is embedded within the dielectric material. One or more via structures are on a first surface of the embedded substrate, where individual ones of the via structures comprise a conductive material and have a tapered profile. The conductive material is also on a sidewall of the embedded substrate.