Company Filing History:
Years Active: 2019-2023
Title: **Chung Kwang Tan: Innovator in Embedded Substrate Technologies**
Introduction
Chung Kwang Tan is a notable inventor based in Chandler, AZ, recognized for his contributions to the field of embedded substrate technologies. With a total of four patents to his name, Tan has made significant advancements in the design and functionality of conductive materials in electronic packaging.
Latest Patents
One of his latest inventions is titled "Via structures having tapered profiles for embedded interconnect bridge substrates." This innovative patent details a package structure that consists of one or more layers of dielectric material, with an interconnect bridge substrate embedded within. The invention features via structures on a first surface of the embedded substrate, where each via includes a conductive material with a tapered profile. Additionally, this conductive material is present on the sidewall of the embedded substrate, enhancing the overall performance and efficiency of electronic devices.
Career Highlights
Currently, Chung Kwang Tan works at Intel Corporation, one of the leading technology companies globally. His role at Intel involves research and development in advanced substrate technologies, where he continuously pushes the boundaries of innovation in this critical sector.
Collaborations
Throughout his career, Tan has collaborated with esteemed colleagues, including Hiroki Tanaka and Robert Alan May. Together, they have driven forward the development of various innovative solutions that address the growing demands of modern electronics.
Conclusion
Chung Kwang Tan's dedication to innovation is evident in his impressive patent portfolio and contributions to the field of embedded substrates. As he continues to work at Intel Corporation, his inventions pave the way for new technologies that will undoubtedly shape the future of electronic devices.